400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera

Product Introduction

The Sony IMX991 SenSWIR InGaAs sensor features 640×512 VGA resolution with 5 µm pixel size, delivering ultra-high-speed imaging performance (over 400 fps). Suitable for laser analysis, material inspection, high-speed sorting, and other dynamic applications, with support for USB3 / GigE / CoaXPress / CameraLink interfaces.

Product Features

  • Sony IMX991 SenSWIR InGaAs, VGA 640×512
  • 5 µm pixel size, high sensitivity 121 mV (typical)
  • Multi-interface support: USB3 / GigE / CoaXPress / CameraLink
  • Ultra-high-speed acquisition (up to 400 fps @ VGA)
  • 59.6–59.7 dB dynamic range (typical)
  • Global shutter, low distortion

Product Models

SWIR Series | Sony IMX991 0.33MP 400–1700 nm Short-Wave Infrared Camera

Model Sensor / Size Resolution Pixel Size Shutter Frame Rate Interface Dynamic
Range
Action
SWIR330KMA
Sony IMX991-AABA-C (InGaAs) 1/4" (4.10 mm) | 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm Global shutter
400 fps @ 640×512 753 fps @ 320×256
USB3
59.7 dB
View Details
SWIR330KMA-G
Sony IMX991-AABA-C (InGaAs) 1/4" (4.10 mm) | 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm Global shutter
257.8 fps @ 640×512 486.1 fps @ 320×256
GigE
59.7 dB
View Details
SWIR330KMA-CXP
Sony IMX991-AABA-C (InGaAs) 1/4" (4.10 mm) | 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm Global shutter
258 fps @ 656×520 486 fps @ 328×260
CoaxPress
58.7 dB
View Details
SWIR330KMB
Sony IMX991-AABJ-C (InGaAs) 1/4" (4.10 mm) | 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm Global shutter
400 fps @ 640×512 753 fps @ 320×256
USB3
59.6 dB
View Details
SWIR330KMB-WUH
Sony IMX991-AABJ-C (InGaAs) 1/4" (8.94 mm × 7.09 mm) | 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm Global shutter
HDMI: 60 fps @ 1920×1080 WiFi/USB: 137 fps @ 640×512
HDMI 1.4 / WiFi / USB Video (Micro USB)
59.6 dB
View Details
SWIR330KMB-G
Sony IMX991-AABJ-C (InGaAs) 1/4" (4.10 mm) | 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm Global shutter
257.8 fps @ 640×512 486.1 fps @ 320×256
GigE
59.6 dB
View Details
SWIR330KMB-UMV
Sony IMX991-AABJ-C (InGaAs) 1/4" (4.10 mm) | 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm Global shutter
428.1 fps @ 640×512 807 fps @ 320×256
USB3
59.6 dB
View Details
SWIR330KMB-GMV
Sony IMX991-AABJ-C (InGaAs) 1/4" (4.10 mm) | 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm Global shutter
257.8 fps @ 640×512 137.1 fps @ 640×512 (12-bit)
GigE
59.6 dB
View Details
SWIR330KMA-CL350
Sony IMX991-AABA-C (InGaAs) 1/4" (4.10 mm) | 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm Global shutter
350 fps @ 640×512 657 fps @ 320×256
CameraLink
59.7 dB
View Details

Quantum Efficiency Curve #

IMX991 SenSWIR 400–1700 nm typical quantum efficiency response

IMX991 SenSWIR quantum efficiency curve
* Official curve for illustrating typical quantum efficiency versus wavelength.

Package Contents #

Standard contents and packing info (switch between interfaces and cooling types)

  • A Outer box (not shown): carton size L: 28.2 cm W: 25.2 cm H: 16.7 cm
  • B 3-A instrument safety case: L: 28 cm W: 23.0 cm H: 15.5 cm (1 pcs, 2.8 kg/box)
  • C SWIR 400–1700 series USB cooled camera
  • D Power cable (CN/US/EU/UK, D1/D2/D3/D4, not shown)
  • E Power adapter: input AC 100–240 V 50/60 Hz; output DC 12 V 3 A
  • F High-speed USB3 A-to-B gold-plated data cable (1.5 m)
  • G External trigger control cable ×1
  • H USB drive (includes driver and software)
USB cooled packing list
USB cooled packing list
  • A Outer box (not shown): carton size L: 28.2 cm W: 25.2 cm H: 16.7 cm
  • B 3-A instrument safety case: L: 28 cm W: 23.0 cm H: 15.5 cm (1 pcs, 2.8 kg/box)
  • C SWIR 400–1700 series GigE cooled camera
  • D Power cable (CN/US/EU/UK, D1/D2/D3/D4, not shown)
  • E Power adapter: input AC 100–240 V 50/60 Hz; output DC 12 V 3 A
  • F External trigger control cable ×1
  • G Network cable: G1 3 m / G2 5 m / G3 10 m (G4 50 m not shown)
  • H USB drive (includes driver and software)
GigE cooled packing list
GigE cooled packing list
  • A Outer box (not shown): carton size L: 28.2 cm W: 25.2 cm H: 16.7 cm
  • B 3-A instrument safety case: L: 28 cm W: 23.0 cm H: 15.5 cm (1 pcs, 2.8 kg/box)
  • C SWIR 400–1700 series 10GigE cooled camera (same exterior as GigE cooled)
  • D Power cable (CN/US/EU/UK, D1/D2/D3/D4, not shown)
  • E Power adapter: input AC 100–240 V 50/60 Hz; output DC 12 V 3 A
  • F External trigger control cable ×1
  • G 10GigE cable (supports high-speed shielded cable)
  • H USB drive (includes driver and software)
10GigE packing list (same exterior as GigE cooled)
10GigE packing list (same exterior as GigE cooled)
  • A Outer box (not shown): carton size L: 28.2 cm W: 25.2 cm H: 16.7 cm
  • B 3-A instrument safety case: L: 28 cm W: 23.0 cm H: 15.5 cm (1 pcs, 2.8 kg/box)
  • C SWIR 400–1700 series CoaXPress cooled camera
  • D Power cable (CN/US/EU/UK, D1/D2/D3/D4, not shown)
  • E Power adapter: input AC 100–240 V 50/60 Hz; output DC 12 V 3 A
  • F CoaXPress cable ×1 (Optional)
  • G External trigger control cable ×1
  • H USB drive (includes driver and software)
CoaXPress cooled packing list
CoaXPress cooled packing list
  • A 3-A instrument safety case: L: 28 cm W: 23.0 cm H: 15.5 cm (1 pcs, 2.8 kg/box)
  • B SWIR 400–1700 series CL cooled camera
  • C CameraLink cable ×2 (Optional)
  • D 12 V / 3 A 6-pin aviation power adapter
  • E Power cable
  • F External trigger control cable ×1
CameraLink cooled packing list
CameraLink cooled packing list
  • A Outer box (not shown): carton size L: 28.2 cm W: 25.2 cm H: 16.7 cm
  • B 3-A instrument safety case: L: 28 cm W: 23.0 cm H: 15.5 cm (1 pcs, 2.8 kg/box)
  • C SWIR 400–1700 series USB uncooled camera (UMV)
  • D High-speed USB3 A-to-B gold-plated data cable (1.5 m)
  • E External trigger control cable ×1
  • F USB drive (includes driver and software)
USB uncooled packing list (UMV)
USB uncooled packing list (UMV)
  • A Outer box (not shown): carton size L: 28.2 cm W: 25.2 cm H: 16.7 cm
  • B 3-A instrument safety case: L: 28 cm W: 23.0 cm H: 15.5 cm (1 pcs, 2.8 kg/box)
  • C SWIR 400–1700 series GigE uncooled camera (GMV)
  • D External trigger control cable ×1
  • E Network cable: G1 3 m / G2 5 m / G3 10 m (G4 50 m not shown)
  • F USB drive (includes driver and software)
GigE uncooled packing list (GMV)
GigE uncooled packing list (GMV)
  • A Outer box (not shown): carton size L: 25.5 cm W: 17.0 cm H: 9.0 cm
  • B SWIR330KMB-WUH SWIR camera
  • C Power adapter: input AC 100–240 V 50/60 Hz; output DC 12 V 1 A (US/EU)
  • D USB mouse
  • E HDMI cable
  • F Micro USB cable
  • G Optional accessories: voice control module, USB drive, WiFi adapter, eyepiece tube adapter, etc.
HDMI/WiFi/USB packing list
HDMI/WiFi/USB packing list
Click the buttons above to switch interface package lists

Product Dimensions #

Outline drawings by interface and cooling type

USB interface
Cooled Outline drawing
GigE interface
Cooled Outline drawing
10GigE interface
Cooled Outline drawing
Same as GigE cooled exterior
CameraLink interface
Cooled Outline drawing
CoaXPress interface
Cooled Outline drawing
Same as USB/GigE cooled exterior
USB interface (UMV)
Uncooled Outline drawing
GigE interface (GMV)
Uncooled Outline drawing
HDMI/WiFi/USB interface
Uncooled Outline drawing
Click images to view full size

IMX991 / IMX990 / IMX992 / IMX993 Sensor Comparison

400–1700 nm SenSWIR family key specs (current page: IMX991)

This page focuses on IMX991 (0.33 MP, 640×512, 5.0 µm): delivers higher full-resolution frame rate and larger pixels within the SWIR family. The table compares IMX990 (1.3 MP), IMX992 (5 MP), and IMX993 (3 MP) for quick selection.

Sensor Resolution Pixel size Spectral range Typical full-res fps (by interface) Bit depth Dynamic range (typical) Available interfaces
IMX991 Current model 0.33 MP (640×512) 5.0 µm 400–1700 nm USB3: 400 fps; GigE: 257.8 fps;
CoaXPress: ≈258 fps (656×520); CameraLink: 350 fps;
HDMI 1.4: 60 fps @ 1920×1080; WiFi/USB: 137 fps @ 640×512
8/12-bit ≈59.6–59.7 dB USB3 / GigE / CoaXPress / CameraLink / HDMI 1.4
IMX990 1.3 MP (1280×1024) 5.0 µm 400–1700 nm USB3: 200 fps; GigE: 90 fps;
CoaXPress: 134 fps; CameraLink: 183 fps
8/12-bit ≈58.7 dB USB3 / GigE / CoaXPress / CameraLink
IMX992 5.0 MP (2560×2048) 3.45 µm 400–1700 nm USB3: 61.9 fps; 10GigE: 145 fps;
CoaXPress: 131 fps; CameraLink: 124 fps
Up to 12-bit (some 8/10/12-bit options) ≈51.36/51.47 dB (HCG/LCG) USB3 / 10GigE / CoaXPress / CameraLink / GigE
IMX993 3.0 MP (2048×1536) 3.45 µm 400–1700 nm USB3: 93 fps; 10GigE: 220 fps;
CoaXPress: 173 fps; CameraLink: 150 fps
Up to 12-bit (some 8/10/12-bit options) ≈51.36/51.47 dB (HCG/LCG) USB3 / 10GigE / CoaXPress / CameraLink / GigE
Note: Frame rates are typical full-resolution values from documentation; bit depth, ROI, and trigger mode will affect actual results.

Frequently Asked Questions

Learn more about SWIR short-wave infrared camera technology

Electromagnetic spectrum diagram: UV 200–380 nm, Visible light 380–750 nm, Near infrared 750–1100 nm, Short-wave infrared 1100–2500 nm, Long-wave infrared 8000–14000 nm
A SWIR camera is a professional imaging device that operates in the short-wave infrared spectrum (approximately 400–1700 nanometers). It can achieve imaging effects that go beyond visible light but differ from thermal imaging cameras (LWIR), making it widely applicable in scenarios requiring high standards for materials, structures, and details.

SWIR cameras have wide applications including industrial inspection, machine vision, material sorting, food testing, scientific research, medical diagnostics, security monitoring, process control, and transportation. They are particularly outstanding in material analysis, moisture detection, penetration through fog/smoke/dust, and night surveillance.

Yes! SWIR cameras can see through certain materials that are opaque to visible light, such as certain plastics and silicon wafers. This capability is extremely valuable for semiconductor inspection, material testing, and other industries.

SWIR cameras primarily capture reflected or emitted light in the short-wave infrared range, unlike thermal imaging cameras (LWIR) which rely on thermal radiation from objects. SWIR cameras have lower thermal sensitivity than thermal imaging cameras and are better suited for structural analysis and material identification rather than direct temperature detection.

Theoretically, yes. SWIR cameras can identify objects or components that cannot be distinguished in visible light through differences in reflection and transmission of materials under short-wave infrared light. They are widely used in security screening, industrial sorting, and inspection applications.

Deep Understanding of SWIR Cameras

Short-Wave Infrared (SWIR) cameras and their core sensors are important components of advanced imaging systems. SWIR technology covers the 900–1700 nanometer wavelength band and has excellent penetration capabilities in harsh environments, such as penetrating fog, smoke, and dust to achieve clear imaging under extreme conditions.

SWIR cameras primarily rely on short-wave infrared light reflection, similar to the visible light band, complementing the application range that thermal imaging cameras (LWIR) cannot cover, providing more complete imaging solutions. They are compact and flexibly integrated, making them easy to apply in various industrial and commercial systems.

The high resolution and high sensitivity of SWIR cameras can meet precision detection and high-requirement applications, capable of detecting minute changes and anomalies in samples, making them very suitable for quality control and defect detection. Some models support cooling, further ensuring imaging quality in high-temperature or high-noise environments.

To reduce system costs and improve integration efficiency, modern SWIR cameras commonly adopt standard optical interfaces and compact designs to accommodate broader application requirements. With the continuous development of imaging markets and technology, SWIR cameras have become one of the key technologies for high-end imaging and sensing in multiple industries due to their unique advantages.

Application Examples

Demonstration of SWIR camera applications in real-world scenarios

More Application Industry References

  • Semiconductor Industry: Solar cell and chip inspection
  • Agriculture: Spectral remote sensing applications via multirotor aircraft
  • Recycling Industry: Material sorting of plastics, waste, and other materials
  • Medical Imaging and Research: Hyperspectral and multispectral imaging
  • Food Industry: Quality inspection and grading
  • Beverage Industry: Liquid level detection in opaque containers
  • Packaging: Seal inspection
  • Glass Industry: High-temperature glass penetration defect detection
  • Printing Industry: See-through hidden features
  • Video Surveillance: Visual enhancement (e.g., smoke penetration)
  • Security: Counterfeit detection, such as currency, wigs, or skin