I3ISPM12000KPB Industrial Camera/Analytical Imaging
Product Introduction
The I3ISPM Series is designed for high-speed dynamic and embedded integration scenarios, featuring high-performance CMOS sensors from Sony/onsemi and others. It offers both global shutter (GS) and rolling shutter (RS) solutions based on application requirements, with resolutions ranging from 0.5 to 20.4 MP. The compact form factor (minimum 33×33×33 mm, with 46.7 mm depth versions available depending on model) facilitates deployment in space-constrained equipment.
Data links include USB3.0, GigE, and CoaXPress (model-dependent), combined with bandwidth control and optional built-in buffer to ensure high-speed stable transmission. The built-in hardware ISP performs real-time processing including Demosaic, AE/AGC, AWB, Gamma/LUT at the camera level. The system supports free-running, software/hardware trigger, and multi-camera synchronization. I/O provides opto-isolated trigger/flash control and programmable GPIO for timing coordination with production lines and experimental equipment.
The system features low power consumption, wide temperature adaptability, and emphasizes long-term stability. It includes ToupView and cross-platform SDK (Windows/Linux/macOS; C/C++/C#/Python, etc.), compatible with DirectShow/TWAIN for secondary development and system integration.
Key Features
- Sensor brands: Sony/onsemi and other high-performance CMOS (model-dependent)
- Resolution coverage from 0.5 to 20.4 MP; high frame rate design suitable for high-speed dynamic imaging
- Shutter types: Global shutter (GS) and rolling shutter (RS) options available (model-dependent)
- Compact form factor: minimum 33×33×33 mm; 46.7 mm depth versions available (model-dependent) for easy embedding
- Multiple interfaces: USB3.0/GigE/CoaXPress (model-dependent, consult online for details), supports bandwidth limiting and long-cable stable transmission
- Built-in hardware ISP: Demosaic, AE/AGC, AWB, one-click white balance, Gamma, LUT, noise reduction/sharpening (model-dependent)
- Acquisition modes: free-running, software trigger, external hardware trigger; supports multi-camera synchronization/flash linkage
- Rich I/O: opto-isolated input/output + programmable GPIO (model-dependent) for coordination with light sources/motion control
- Image functions: ROI/windowing, digital binning (2×2/3×3/4×4 model-dependent), mirror/flip, bit depth 8/10/12/16-bit (model-dependent)
- Optional built-in buffer for enhanced data integrity during high-speed/burst acquisition (model-dependent)
- Low power consumption and wide temperature adaptability design supporting long-term continuous stable operation
- Software and development: includes ToupView; Windows/Linux/macOS SDK (C/C++/C#/Python), compatible with DirectShow/TWAIN
- Supports field firmware upgrade; CE/FCC/RoHS compliant (model-dependent)
Product Details
| Key Parameters | |
| Model | I3ISPM12000KPB |
| Sensor | Sony IMX676-AACR |
| Effective Pixels / Resolution | 12.0 MP (3536×3536) |
| Frame Rate (Full Resolution) | 27.7 fps @ 3536×3536; 65.8 fps @ 1760×1760 |
| Shutter Type | Rolling Shutter |
| Color Type | Color |
| Imaging Performance | |
| Pixel Size | 2.0 µm × 2.0 µm |
| Sensor Size | 7.07 mm × 7.07 mm |
| Diagonal | 1/1.6" (10 mm) |
| Dynamic Range | TBD |
| Bit Depth | 8/12-bit |
| Sensitivity | 280 mV |
| Interface & Mechanical | |
| Data Interface | USB3.0 |
| GPIO | 1 opto-isolated input, 1 opto-isolated output, 1 non-isolated I/O port |
| Lens Mount | C-mount |
| Dimensions | 33 mm × 33 mm × 33 mm |
| Weight | 70 g |
| Power Supply | USB3.0 interface powered |
| Environment & Certification | |
| Operating Temperature / Humidity | -10 °C to +50 °C / 20% to 80% (non-condensing) |
| Storage Temperature / Humidity | -30 °C to +70 °C / TBD |
| Operating System | Windows/Linux/macOS/Android multi-platform SDK (native C/C++, C#/VB.NET, Python, Java, DirectShow, Twain, etc.) |
| Certification | CE/FCC |
Product Overview
The I3ISPM12000KPB represents the pinnacle of ultra-compact industrial camera engineering, specifically designed for demanding space-constrained applications requiring exceptional performance. Featuring a Sony IMX676-AACR high-performance image sensor within an extraordinarily compact form factor, this platform delivers professional-grade capabilities that establish new standards for space-efficient industrial imaging solutions.
Ultra-Compact Engineering Excellence
The I3ISPM Series achieves remarkable performance density through advanced miniaturization technologies that deliver 12.0 MP (3536×3536) resolution within an unprecedented 33 mm cubic form factor. This engineering achievement addresses the critical requirements of modern automation systems where space represents the ultimate constraint while performance cannot be compromised. The 2.0 µm × 2.0 µm pixel architecture across a 7.07 mm × 7.07 mm sensor format ensures exceptional detail resolution despite the extremely compact physical implementation.
The dual-shutter architecture implementation provides unprecedented flexibility by supporting both global shutter precision for motion-critical applications and rolling shutter efficiency for high-resolution static imaging. This adaptive approach enables optimal performance across diverse application scenarios while maintaining the ultra-compact form factor that defines this platform. The Rolling Shutter capability ensures that customers can optimize performance for specific requirements without compromising installation constraints.
Exceptional Speed and Connectivity
The advanced USB3.0 interface architecture enables extraordinary frame rates reaching 27.7 fps @ 3536×3536; 65.8 fps @ 1760×1760 , establishing new performance benchmarks for ultra-compact industrial cameras. This capability supports the most demanding high-speed inspection applications while maintaining the space-efficient design that enables deployment in previously impossible installation scenarios. The high-bandwidth connectivity ensures that data throughput never becomes a limiting factor in automated manufacturing environments.
Professional image processing capabilities include 8/12-bit color depth processing with dynamic range specifications exceeding TBD . These parameters ensure exceptional image quality and measurement accuracy essential for precision manufacturing applications where defect detection and dimensional analysis require the highest levels of reliability and repeatability across diverse materials and lighting conditions.
Advanced Integration Capabilities
The sophisticated GPIO architecture provides comprehensive connectivity for external devices and sensor integration, enabling complex automation systems to coordinate multiple devices through centralized control interfaces. This capability addresses the growing complexity of modern manufacturing systems where cameras must integrate seamlessly with lighting controllers, motion systems, and quality control databases to deliver comprehensive inspection solutions.
Optimized sensitivity specifications of 280 mV ensure consistent performance across varying illumination conditions typical in industrial environments. The standard C-mount interface provides universal compatibility with industrial lens systems, while optional 0.5×/0.63×/1× relay adapters enable integration with specialized optical configurations that address unique application requirements.
Operational Excellence and Development Support
The ultra-compact cubic design measuring precisely 33 mm × 33 mm × 33 mm with minimal system weight of 70 g revolutionizes installation possibilities in space-critical automation environments. The USB3.0 interface powered power architecture eliminates additional power infrastructure requirements, significantly reducing system complexity and installation costs while ensuring reliable operation in demanding industrial conditions.
Comprehensive software development support includes professional SDK compatibility across C/C++, C#, Python, DirectShow, GenICam development environments and Windows/Linux/macOS/Android multi-platform SDK (native C/C++, C#/VB.NET, Python, Java, DirectShow, Twain, etc.) operating system platforms. This extensive compatibility ensures seamless integration with existing automation infrastructure while enabling custom application development that leverages the unique capabilities of this ultra-compact platform for specialized manufacturing requirements.
Critical Performance Metrics
Resolution
12.0 MP (3536×3536)
Frame Rate
Up to 27.7 fps @ 3536×3536; 65.8 fps @ 1760×1760
Pixel Size
2.0 µm × 2.0 µm
Data Interface
USB3.0
Advanced Application Capabilities
Ultra-Compact Integration
Revolutionary 33 mm cubic form factor enables installation in previously impossible locations while maintaining professional-grade performance specifications essential for demanding automation applications
Extreme Speed Performance
Exceptional frame rates up to 620 fps enable capture of the fastest manufacturing processes and dynamic events requiring precise temporal resolution and motion analysis capabilities
Adaptive Shutter Technology
Dual-mode shutter capability provides optimal performance for both motion-critical applications requiring global shutter precision and high-resolution static imaging using rolling shutter efficiency
Comprehensive I/O Integration
Advanced GPIO architecture supports complex automation system integration with extensive connectivity options for external devices, sensors, and control systems coordination
Engineering Excellence
The I3ISPM12000KPB ultra-compact industrial camera represents a breakthrough in space-efficient engineering that delivers exceptional performance within unprecedented size constraints. This platform addresses the most challenging installation requirements in modern automation while maintaining professional-grade capabilities essential for demanding manufacturing environments where both performance and space efficiency represent critical success factors.
I3ISPM12000KPB Technical Specifications
Complete technical documentation including detailed specifications, performance characteristics, and integration guidelines
Advanced SDK Package
Professional development kit supporting Windows, Linux, macOS with comprehensive API documentation and integration examples
Precision CAD Models
Ultra-precise STEP format models optimized for space-critical mechanical design integration and system planning
Package Contents #
Standard contents for I3 industrial machine vision cameras (USB3 / GigE / 10GigE)
Recommended kit (USB3)
- Camera body - USB3.0 interface
- I/O cable - 6-pin cable or extension cable
- USB3.0 cable - Micro USB3.0 cable
- Lens (optional)
Recommended kit (GigE)
- Camera body - GigE interface
- I/O cable - 6-pin cable or extension cable
- GigE cable
- Lens (optional)
Recommended kit (10GigE)
- Camera body - 10GigE interface
- Power adapter - 12 V/36 W aviation power supply
- I/O cable - 7-pin cable or extension cable
- 10GigE cable
- Lens (optional) - M42 or F-mount lens
Product Dimensions #
Outline dimensions for I3 industrial machine vision cameras
The I3ISPM Series is ToupTek’s compact, high-speed USB3.0 industrial camera line, spanning 0.5–20.4 MP with Sony and Gpixel high-performance CMOS sensors from 1/2.9" to 1.1" formats. With a 33×33×33 mm cube body, it offers both global and rolling shutter options to balance high frame rates and image quality—ideal for automation, machine vision, and scientific imaging.
Key Features
Ultra-compact design
33×33×33 mm cube body
Global shutter options
Most models; smear-free imaging
Ultra-high speed
Up to 600 fps capability
Multi-resolution coverage
0.5 MP to 20.4 MP range
Performance highlights
Peak frame rate
600 fps
Low-resolution modeResolution range
0.5-20.4 MP
Multiple optionsBody size
33 mm cube
Only 70 gDynamic range
73 dB
High contrastIn-Depth Overview
Wide sensor platform
Built on sensors such as Sony IMX433, IMX273, IMX252, IMX541, and Gpixel GMAX4002, covering needs from low-resolution high-speed to high-pixel precision imaging. Pixel sizes from 2.74 µm to 9.0 µm balance sensitivity and detail. Typical models reach up to 73 dB dynamic range and 50 dB SNR for accurate imaging in high-contrast environments.
Excellent high-speed performance
Frame rates up to 600 fps (low-resolution mode); high-pixel models like 20.4 MP still achieve 17.5 fps at 4496×4496. 0.5 MP models reach 166.5 fps @ 812×620, 2.4 MP models reach 620 fps @ 1024×600. Supports 1×1, 2×2, 3×3, 4×4 hardware/software binning to balance speed and sensitivity.
Advanced shutter options
Most models offer global shutter for fast motion without smearing; rolling shutter options support high dynamic range needs. Wide exposure from 6 µs to 15 s with 8-bit/10-bit/12-bit outputs provides flexibility for varied inspection and analysis.
Ultra-compact industrial design
33×33×33 mm cube, only 70 g, full metal housing. Power below 3.5 W; operating range -10 to +50 °C, humidity 20%–80% (non-condensing) for long-term stability. Opto-isolated and non-isolated I/O enable line integration and external triggering.
Complete software ecosystem
Supports Windows, Linux, macOS, Android with APIs for C/C++, C#/VB.NET, Python, DirectShow, and TWAIN to simplify secondary development. Rich SDK functions and full documentation make system integration straightforward for automation, machine vision, and research deployment.
Applications
I3ISPM Series use cases across industrial imaging
I3ISPM Series Key Advantages
Ultra-compact
33 mm cube form factor
Ultra-high speed
600 fps capture
Global shutter
Ghost-free imaging
Multi-resolution
0.5–20.4 MP options
Ultra-lightweight
Only 70 g
Flexible binning
4 modes
Low power
<3.5 W
Rich I/O
Opto-isolated